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 PD- 95188
IRG4PH40UDPBF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
Features
* UltraFast: Optimized for high operating frequencies up to 40 kHz in hard switching, >200 kHz in resonant mode * New IGBT design provides tighter parameter distribution and higher efficiency than previous generations * IGBT co-packaged with HEXFREDTM ultrafast, ultra-soft-recovery anti-parallel diodes for use in bridge configurations * Industry standard TO-247AC package * Lead-Free
C
UltraFast CoPack IGBT
VCES = 1200V
G E
VCE(on) typ. = 2.43V
@VGE = 15V, IC = 21A
n-ch an nel
Benefits
* Higher switching frequency capability than competitive IGBTs * Highest efficiency available * HEXFRED diodes optimized for performance with IGBT's . Minimized recovery characteristics require less/no snubbing
TO-247AC
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25C IC @ TC = 100C ICM ILM IF @ TC = 100C IFM VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Q Clamped Inductive Load Current R Diode Continuous Forward Current Diode Maximum Forward Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 screw.
Max.
1200 41 21 82 82 8.0 130 20 160 65 -55 to + 150 300 (0.063 in. (1.6mm) from case ) 10 lbf*in (1.1N*m)
Units
V
A
V W C
Thermal Resistance
Parameter
RJC RJC RCS RJA Wt Junction-to-Case - IGBT Junction-to-Case - Diode Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Weight
Min.
--- --- --- --- ---
Typ.
--- --- 0.24 --- 6 (0.21)
Max.
0.77 1.7 --- 40 ---
Units
C/W
g (oz)
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1
04/26/04
IRG4PH40UDPBF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
VCE(on)
VGE(th) VGE(th)/TJ gfe ICES VFM IGES
Parameter Min. Typ. Collector-to-Emitter Breakdown VoltageS 1200 -- Temperature Coeff. of Breakdown Voltage -- 0.43 Collector-to-Emitter Saturation Voltage -- 2.43 -- 2.97 -- 2.47 Gate Threshold Voltage 3.0 -- Temperature Coeff. of Threshold Voltage -- -11 Forward Transconductance T 16 24 Zero Gate Voltage Collector Current -- -- -- -- Diode Forward Voltage Drop -- 2.6 -- 2.4 Gate-to-Emitter Leakage Current -- --
Max. Units Conditions -- V VGE = 0V, IC = 250A -- V/C VGE = 0V, IC = 1.0mA 3.1 IC = 21A VGE = 15V -- V IC = 41A See Fig. 2, 5 -- IC = 21A, TJ = 150C 6.0 VCE = VGE, IC = 250A -- mV/C VCE = VGE, IC = 250A -- S VCE = 100V, IC = 21A 250 A VGE = 0V, VCE = 600V 5000 VGE = 0V, VCE = 600V, TJ = 150C 3.3 V IC = 8.0A See Fig. 13 3.1 IC = 8.0A, TJ = 125C 100 nA VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Ets LE Cies Coes Cres trr Irr Qrr di (rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge Diode Peak Rate of Fall of Recovery During tb Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 86 13 29 46 35 97 240 1.80 1.93 3.73 42 32 240 510 7.04 13 1800 120 18 63 106 4.5 6.2 140 335 133 85 Max. Units Conditions 130 IC = 21A 20 nC VCC = 400V See Fig. 8 44 VGE = 15V -- TJ = 25C -- ns IC = 21A, VCC = 800V 150 VGE = 15V, RG = 10 360 Energy losses include "tail" and -- diode reverse recovery. -- mJ See Fig. 9, 10, 18 4.6 -- TJ = 150C, See Fig. 11, 18 -- ns IC = 21A, VCC = 800V -- VGE = 15V, RG = 10 -- Energy losses include "tail" and -- mJ diode reverse recovery. -- nH Measured 5mm from package -- VGE = 0V -- pF VCC = 30V See Fig. 7 -- = 1.0MHz 95 ns TJ = 25C See Fig. 160 TJ = 125C 14 IF = 8.0A 8.0 A TJ = 25C See Fig. 15 VR = 200V 11 TJ = 125C 380 nC TJ = 25C See Fig. 880 TJ = 125C 16 di/dt = 200A/s -- A/s TJ = 25C See Fig. -- TJ = 125C 17
2
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IRG4PH40UDPBF
25
For both:
20
LOAD CURRENT (A)
D uty cy cle: 50% TJ = 125C T s ink = 90C G ate drive as specified P ow e r Dis sip ation = 35 W
S q u a re w a v e : 6 0% of rate d volta ge
15
10
I
5
Id e a l d io d e s
0
0.1
1
10
100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
100
I C, Collector-to-Emitter Current (A)
I C , Collector-to-Emitter Current (A)
10
TJ = 150 o C
TJ = 150 o C
10
TJ = 25 o C V = 15V 20s PULSE WIDTH
GE 1 10
TJ = 25 o C
1
1
V = 50V 5s PULSE WIDTH
CC 5 6 7 8 9 10
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4PH40UDPBF
50 4.0 40
VCE , Collector-to-Emitter Voltage(V)
V = 15V 80 us PULSE WIDTH
GE
I C = 42 A
Maximum DC Collector Current(A)
3.0
30
I C = 21 A I C =10.5 A
2.0
20
10
0
25
50
75
100
125
150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , Case Temperature ( C)
TJ , Junction Temperature ( C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
1
Thermal Response (Z thJC )
D = 0.50
0.20 0.1 0.10 0.05 0.02 0.01
SINGLE PULSE (THERMAL RESPONSE) 0.0001 0.001 0.01
0.01 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.1
P DM t1 t2 1
t1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PH40UDPBF
4000
VGE , Gate-to-Emitter Voltage (V)
C, Capacitance (pF)
3000
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 21A
16
Cies
2000
12
8
1000
C oes C res
4
0
1
10
100
0
VCE , Collector-to-Emitter Voltage (V)
0
20
40
60
80
100
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
5.0
Total Switching Losses (mJ)
4.5
Total Switching Losses (mJ)
VCC = 800V VGE = 15V TJ = 25 C I C = 21A
100
RG = 10 Ohm VGE = 15V VCC = 800V
IC = 42 A
10
4.0
IC = 21 A IC = 10.5 A
3.5
3.0
0
10
20
30
40
50
1 -60 -40 -20
0
20
40
60
80 100 120 140 160
RGG,, Gate Resistance( (Ohm) R Gate Resistance )
TJ , Junction Temperature ( C )
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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5
IRG4PH40UDPBF
16
12
8
I C , Collector-to-Emitter Current (A)
20 30 40 50
Total Switching Losses (mJ)
RG TJ VCC VGE
= 10 Ohm = 150 C = 800V = 15V
1000
VGE = 20V T J = 125 oC
100
10
4
0
SAFE OPERATING AREA
0 10
1
I C , Collector-to-emitter Current (A)
1
10
100
1000
10000
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
100
Fig. 12 - Turn-Off SOA
Insta ntaneo us F orw ard Cu rrent - I F (A )
10
TJ = 15 0C TJ = 12 5C TJ = 2 5C
1 0 2 4 6 8 10
Fo rwa rd V oltage D rop - V F M (V )
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4PH40UDPBF
200 100
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
160
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
I F = 16A
t rr - (ns)
120
I F = 8 .0 A I F = 4 .0A
I IR R M - (A )
I F = 1 6A I F = 8.0A
10
80
I F = 4 .0 A
40
0 100
d i f /d t - (A / s)
1000
1 100
di f /dt - (A /s)
1000
Fig. 14 - Typical Reverse Recovery vs. dif/dt
600
Fig. 15 - Typical Recovery Current vs. dif/dt
1000
500
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
I F = 4 .0A
400
d i(re c)M /d t - (A /s)
Q R R - (nC )
I F = 16 A
300
I F = 8.0 A
100
I F = 1 6A
I F = 8 .0A
200
I F = 4 .0A
100
VR = 2 0 0 V T J = 1 2 5 C T J = 2 5 C
10 100
0 100
d i f /d t - (A / s)
1000
di f /dt - (A /s)
1000
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
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7
IRG4PH40UDPBF
90% Vge Same ty pe device as D .U.T. +Vge
Vce
80% of Vce
430F D .U .T. Ic
10% Vce
9 0 % Ic Ic 5 % Ic
td (o ff)
tf
Eoff =
Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1 t2
Vce Ic dt
t1 + 5 S V c e ic d t t1
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O L T A G E D .U .T . 1 0 % +V g +Vg
Ic
trr
Q rr =
Ic dt
V cc
trr id d t tx
tx 10% Vcc Vce Vcc 1 0 % Ic 9 0 % Ic D UT VO LTAG E AN D CU RRE NT Ip k V pk
1 0 % Irr
Irr
Ic D IO D E R E C O V E R Y W A V E FO R M S
td (o n )
tr
5% Vce t2 Vce d E o n = V ce ieIc t dt t1
E re c = D IO D E R E V E R S E REC OVERY ENER GY t3 t4
t1
t2
Vd Ic dt
t4 V d id d t t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
8
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IRG4PH40UDPBF
V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
L 1000V 50V 6000 F 100 V Vc*
D.U.T.
RL= 0 - 800V
800V 4 X IC @25C
Figure 19. Clamped Inductive Load Test Circuit
Figure 20. Pulsed Collector Current Test Circuit
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9
IRG4PH40UDPBF
Notes:
Q Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20) R VCC=80%(VCES), VGE=20V, L=10H, RG= 10 (figure 19) S Pulse width 80s; duty factor 0.1%. T Pulse width 5.0s, single shot.
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
EXAMPLE: T HIS IS AN IRFPE30 WIT H ASS EMBLY LOT CODE 5657 ASS EMBLED ON WW 35, 2000 IN T HE AS SEMBLY LINE "H"
Note: "P" in assembly line position indicates "Lead-Free"
INT ERNAT IONAL RECT IFIER LOGO ASS EMBLY LOT CODE
PART NUMBER
IRFPE30
56 035H 57
DATE CODE YEAR 0 = 2000 WEEK 35 LINE H
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 04/04
10
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Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/


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